Micronox MX2322

MICRONOX® MX2322 is a semiconductor grade engineered semi aqueous solvent and designed to clean all types of paste fluxes common in wafer bumping, wafer level packaging, die attach, flipchip and SiP that contain copper pillar. MX2322 has a wide process window, as well as a long bath life, to remove tough flux residue at a fast rate and is compatible with all sensitive metals. MX2322 demonstrates its excellent cleaning performance and benefits in single-wafer spray-in-air tools as well as all immersion cleaning systems.



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