Kyzen’s Mike Bixenman to Present OA Flux Cleaning Studies at APEX 2010

NASHVILLE — March 26, 2010 — Kyzen, the world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Dr. Mike Bixenman will present a paper titled “OA Flux Cleaning Studies on Highly Dense Advanced Packages Parameters” at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas. The presentation will be held during Session S07, titled “Cleaning II,” which will take place Tuesday, April 6, 2010 from 3:15-4:45 p.m.

Cleaning flux residues post-soldering has been a high-reliability criterion practiced by assemblers of military, aerospace, automotive, medical devices and other value offerings. Highly dense advanced packages reduce spacing between I/Os and standoff heights. The complexity of removing flux residue increases, while elevating the risk of white residue under low standoff (gap) components.

To address this concern, many electronics assemblers use water-soluble solder paste and clean post-soldering. The purpose of this factorial designed experiment is to evaluate multiple water-soluble flux materials and cleaning chemistries, including DI water only, to determine the best chemical properties for removing lead-free water soluble flux residues. The optimal process parameters will be defined with data findings analyzed and presented using statistical analysis and models.

For more information, or to view the schedule of events, visit www.goipcshows.org.

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Kyzen is a leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries. Founded in 1990, Kyzen offers superior cleaning chemistries, technical support, application and analytical services throughout the world. Kyzen has won numerous industry awards for their exceptional products and all products are RoHS compliant.