Stencil cleaning has taken an increasingly important role in surface mount technology. The cleanliness of the stencil is critical to the success of the stencil printing process. Fine and ultra-fine pitch pads, together with other advanced packages, place new demands on stencil cleaning. Process Engineers estimate that 70% of surface mount technology defects are due to solder paste printing problems. Many of these problems result in misprints — paste where it should not be, or missing solder paste from where it should be, resulting in shorts, solderballs, or lack of sufficient paste when the PCB or PWA is reflowed.

Modern Kyzen Corporation chemistries are designed for enhanced cleaning of misprint solder paste, dispensing flux, uncured adhesives. Application specific formulas are available for under stencil automated wipe, ultrasonic and spray cleaning. In addition, B-side SMT misprint cleaning processes are now effectively cleaned using these robust formulas.

* not available in Europe