Vapor degreasing is a well-known technology that offers many benefits to industry. One solvent is used to wash, rinse and dry parts in simple, compact and affordable equipment. Until ozone depletion concerns arose, vapor degreasing technology was the cleaning method of choice for most industries.

Recent cleaning solvent research activities by Kyzen have been directed at the development of new environmentally friendly agents for cleaning flux from bumped silicon wafers.

In response to our customers needs for safe, environmentally acceptable solvents for the removal of flux residues in the most critical cleaning applications. Kyzen introduces two vapor phase fluids ....... Micronox MX2512 and Micronox MX2955.

Micronox Vapor Phase fluids are designed for the removal of:

• Flux from eutectic and high lead processes
• Dust & particulate matter
• Grease & wax

In addition to the new product offerings, Kyzen Corporation can offer a semi-aqueous formula, Micronox MX2302 for immersion or manual applications. MX2302 has a long pedigree of effective and safe cleaning of bumped wafers in many spray tool and centifugal cleaning applications. SEM- EDS and FE-AES (Auger) analysis of bumped wafers after cleaning with MX2302 show no metalurgical variations.

MX2302 is an engineered semi-aqueous solution for precision defluxing. In addition to soldering operations the MX2302 is effective on a wide range of uncured adhesive materials and has excellent compatibility with all soldering materials, passivation layers (PI, Nitride, Silicon Dioxide, BCB, etc.) and metal layers. MX2302 is designed for effective cleaning of high lead, eutectic and lead-free bumping and advanced packaging processes.