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Home arrow Applications arrow Advanced Packaging arrow Flip Chip, IC Device Package, Lead Frame
Flip Chip, IC Device Package, Lead Frame | Print |

Aqueous Cleaning is a well-known technology that has been used for many years. Over the last 5 years, flux technology encompassing “no-clean” and lead free has radically changed and as a result aqueous cleaning products have changed as well. With Kyzen Corporation’s Micronox product family, precise, cost effective cleaning of advanced packaging components are no longer a challenge.

With Micronox we have proven performance and a cost effective cleaning process used on all types of advanced packages used in OEM, CM, Military and Space Hardware.

Application specific chemistry is available for your aqueous in-line, single chamber batch spray console or ultrasonic and immersion cleaning tools.

Answering the needs of engineers in all fields, Kyzen Corporation offers modern cleaning chemistry proven effective on:

  • Rosin
  • No clean/low residue flux and solder paste formulations
  • Modern water soluble fluxes designed for lead free process.
  • High lead alloy composition lead frame, BGA and flip chip devices
  • High solid content Tack Flux

In addition it is no longer neccesary for solvent useage in your Microline or Microcel centrifugal cleaning tool. Kyzen Corporation's Micronox MX2125 and MX2130 have been tested as direct drop in solutions for these cleaning processes.

 

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